Intel core 2 duo e6600 year of manufacture. Available options for embedded systems

Alexey Shobanov

“Finally, what we have been waiting for has happened!” For the third month now, they have been replete with exclamations like these or ones similar in meaning. computer publications, devoting more and more reviews and tests to Core 2 Duo processors, the release of which Intel announced in mid-July. The appearance of these chips, built on the new Intel Core microarchitecture, without exaggeration, became the main event of the current year, demonstrating to everyone that the “crisis of the genre” has been overcome and all the problems associated with the previous Intel NetBurst microarchitecture are behind us. Naturally, our magazine did not stand aside either - a number of articles were published on its pages, telling both about the features of the architecture of new processors, and about chipsets and motherboards designed to work with them. But, unfortunately, until recently we were not able to conduct a direct comparison of new processors from Intel with solutions from their main competitor - Advanced Micro Devices (AMD). Moreover, AMD, anticipating the release of Core 2 Duo, presented its new platform AM2 (which was also described in detail on the pages of our magazine). It is based on processors built on the AMD64 microarchitecture, which has long been familiar to us, but in this case has a built-in memory controller capable of supporting DDR2 SDRAM memory and made in a new form factor with an AM2 processor socket. Today we finally had the opportunity to bring our competitors face to face and evaluate their capabilities in performing a wide range of tasks. For comparison, we chose Intel Core 2 Duo E6600 and AMD Athlon 64 X2 5000+, and here's why: both models have about the same price. Thus, the AMD Athlon 64 X2 5000+ processor in batches of a thousand units costs $301, and the Intel E6600 costs $316. In addition, today both chips occupy the same place in model range manufacturing companies, being the second oldest model in their respective lines. In table 1 shows some of the key characteristics of these chips.

Table 1. Characteristics of AMD Athlon 64 X2 5000+ and Intel Core 2 Duo E6600 processors

CPU

AMD Athlon 64 X2 Dual-Core

Intel Core 2 Duo

Frequency, MHz

System bus, frequency, MHz/
throughput, GB/s

HyperTransport/2000/8

Quad Pumped Bus/1067/8.5

Number of Cores

Maximum temperature, °C

L1 Cache instructions, KB

L1 Data Cache, KB

L2 Cache, KB

Energy saving technology

Cool'n'Quiet

Enhanced Intel Speed ​​Step

SIMD instruction set

Technical process

CPU socket

In order to compare the capabilities of these two processors, we used a number of specialized programs, as well as test scenes and scripts for popular applications, which allowed us to evaluate the performance computer systems based on these central processing units to perform various tasks. Here is a list of tests and applications used:

  • Overall PC performance:

Crystal Mark 9.0;

  • scientific calculations: Science Mark 2.0;
  • audio encoding: Lame 3.98a;
  • video encoding:

XMPEG 5.2 Beta + DivX Converter 6.2.5,

Windows Media Encoder 9

TMPGEnc 2.524,

MainConcept MPEG Encoder 1.51,

MainConcept H.264 Encoder v.2.0;

  • office applications:

VeriTest Business Winstone 2004 v.1.0.1,

VeriTest Business Winstone 2004 Multitasking Test v.1.0.1,

VeriTest Multimedia Content Creation 2004 v.1.0.1;

  • archiving:
  • gaming tests:

Doom 3 (path 1.3),

Far Cry (patch 1.33),

Quake 4 (patch 1.05, SMP-Enable);

  • working with 3D graphics:

Discreet 3ds Max 7.0 (script SPECapc 3ds max 7 v.2.1.3),

Alias ​​WaveFront Maya 6.5 (script SPECapc Maya 6.5 v1.0);

Digital photo processing: Adobe Photoshop CS2.

For testing, two stands were assembled:

  • for AMD Athlon 64 X2 5000+ processor:

Motherboard - ASUS M2N32-SLI Deluxe (chipset - NVIDIA nForce 590 SLI),

Hard drive: Seagate Barracuda 7200.7 120 GB (ST3120827AS), file structure NTFS;

  • for Intel Core 2 Duo E6600 processor:

Motherboard - ASUS P5B Deluxe (chipset - Intel P965 Express),

Video card - Sapphire RADEON 1900 XTX,

System memory - 2xCorsair CM2X512-8500 in DDR2-800 SDRAM mode (total capacity 1 GB), timings 4-4-4-12 (CAS Latency-RAS to CAS Delay-Row Precharge-Active to Precharge),

Hard drive - Seagate Barracuda 7200.7 120 GB (ST3120827AS), NTFS file structure.

Testing was carried out under operating system control Microsoft Windows XP SP2 with ATI CATALYST 6.7 video driver installed.

Let us turn to the results we obtained during testing (Table 2). Based on the results of synthetic tests FutureMark PCMark 2005 and CrystalMark 9.0, which allow us to evaluate the performance of individual subsystems of a computer system, we see that the performance of the processor subsystem and memory subsystem of the configuration, which is based on Intel processor Core 2 Duo E6600, 10-15% higher than similar subsystems based on AMD Athlon 64 X2 5000+. At the same time, subtests related to other subsystems (disk and graphics) did not reveal any significant advantage of the Intel platform, with the exception of the OpenGL test OGL CrystalMark 9.0, which, however, calculates geometry with intensive loading central processor, therefore, it is impossible to say that this is a pure test of the graphics subsystem. Moreover, in two other graphics tests of the same test suite - GDI and D2D - the AMD Athlon 64 X2 5000+ platform had a noticeable advantage over the competing solution. A similar situation arose in subtests assessing the performance of the disk subsystem: according to the results of the HDD FutureMark PCMark 2005 test for a computer system based on an AMD processor, it was the same for both computer systems, and according to the results of the HDD CrystalMark 9.0 test it was 12% higher than for the platform Intel. From all that has been said, we can draw a very important conclusion: when conducting all subsequent tests, the resulting difference in performance between the compared configurations (if we're talking about that the advantage is on the side of the Intel platform) is determined primarily by the capabilities of the processor subsystem and the processor-memory link, since neither the graphics nor the disk subsystem in this case has any advantage over a competing solution.

Table 2. Test results for AMD Athlon 64 X2 5000+ and Intel Core 2 Duo E6600 processors

AMD Athlon 64 X2 5000+

Intel Core 2 Duo E6600

Difference (%)

Price, dollars

FutureMark PCMark 2005

Science Mark 2.0

Molecular Dynamics

Memory Benchmarks

Audio encoding (Lame 3.98a), with

Video encoding

Windows Media Encoder 9 (AVI -> WMV), with

TMPEGEnc 2.524 (AVI -> M2V+WAV), with

MainConcept H.264 Encoder v.2.0 (AVI -> MPG), with

MainConcept MPEG Encoder v.1.51 (AVI -> MPG), with

VeriTest Business Winstone 2004 v.1.0.1

VeriTest Business Winstone 2004 v.1.0.1 Multitasking Test

VeriTest Multimedia Content Creation Winstone 2004 v.1.0.1

Archiving

7-Zip 4.42 (dictionary size 64 MB, word length 256 KB), with

WinRar 3.51 (compression method: normal), c

HDR/SM 3.0 Score

Half-Life 2, resolution 1024x768

DOOM 3 (path 1.3), resolution 1024x768

Far Cry (patch 1.33), resolution 1024x768

Quake 4 (patch 1.05, SMP-Enable), resolution 1024x768

Discreet 3ds Max 7.0 + SPECapc 3dsmax7 v.2.1.3 (Software Render)

Alias ​​WaveFront Maya 6.5

(SPECapc Maya 6.5 v1.0)

Adobe Photoshop CS2, with

Next up is a set of tests for the Science Mark 2.0 utility, designed to evaluate system performance when performing scientific calculations. Looking at the results of these tests, it is easy to see that when performing scientific computing (Molecular Dynamics, Primordia and Cryptography subtests), the advantage of the AMD Athlon 64 X2 5000+ looks very convincing. This result is quite understandable, since it has long been known that floating point operations (on which all calculations performed in this case are based) are the strong point of AMD processors with the K8 generation core, as well as the K7. Although in this case it is very interesting that in a pure synthetic test for performing BLAS/FLOPs floating point operations (calculating special matrices ranging in size from 64x64 to 1536x1536), the Intel processor turns out to be a third faster!

Another set of tests where the AMD Athlon 64 X2 5000+ processor managed to prevail over the Intel processor was the VeriTest 2004 package, which simulates the user’s work with office applications (VeriTest Business Winstone 2004 v.1.0.1), as well as creating the Internet -content (VeriTest Multimedia Content Creation Winstone 2004 v.1.0.1). It can be assumed that in this case the slight advantage of the AMD platform is due to a slightly best job disk subsystem and higher processor clock speed (2.6 versus 2.4 GHz for the Intel Core 2 Duo E6600). Moreover, in the multitasking test when working with office applications (VeriTest Business Winstone 2004 v.1.0.1 Multitasking Test) Intel platform turns out to be more productive. Most likely, one of the reasons for this was the more efficient use of the second level cache (L2), which is common and not individual for each of the cores (as is implemented in processors of the AMD Athlon 64 X2 family) and also has four times more volume (4 MB versus a total of 1 MB for the AMD Athlon 64 X2 5000+).

On tasks of encoding video and audio files and archiving, the system with the Intel Core 2 Duo E6600 processor turned out to be significantly faster than the platform on the AMD Athlon 64 X2 5000+ - its gain here ranged from 4.4 (MainConcept H.264 Encoder v.2.0) to 24. 5% (MainConcept MPEG Encoder v.1.51). Moreover, this advantage was achieved by the processor from Intel has already not due to a higher clock frequency, as was the case with NetBurst architecture processors, but due to better organization working with streaming data...

What about games? Until recently, the advantages when testing gaming applications unconditionally remained with AMD processors. And it was on its own field that the brainchild of Advanced Micro Devices this time suffered a crushing defeat. In all gaming tests The first was the platform based on Intel Core 2 Duo E6600, and in test scenes of real games the advantage was quite significant (from 21% in the scene for Quake 4 to 38.8% for Half-Life 2).

In tests assessing system performance when working in the popular 3D packages Discreet 3ds Max 7.0 and Alias ​​WaveFront Maya 6.5, as well as when executing a script simulating the user's work processing digital photos in Adobe Photoshop CS2, the advantage of the Intel Core 2 Duo E6600 processor over its competitor also does not raise the slightest doubt.

Thus, based on the results of this comparison, we can state: the new Duo 2 Core processors from Intel, built on the Intel Core microarchitecture, today significantly surpass the solutions of competitors in terms of performance, the only serious of which is Advanced Micro Devices. In addition, we can say that the enemy, represented by the AMD Athlon 64 X2 5000+, which acted here as a successor to the glorious legacy of processors with the AMD64 microarchitecture, was beaten with its own weapons. Thus, having abandoned the race for frequencies, which was embodied in the processors of the family Intel Pentium 4 with their NetBurst microarchitecture, Intel has focused on increasing the number of operations performed per clock and optimizing the execution of calculations in Intel Core. It is also interesting that the Intel Core 2 Duo E6600 outperformed its opponent not only in pure performance, but also in all its relative terms: relative performance per unit of cost and relative performance per unit of power. Let us recall that the TDP of the Intel Core 2 Duo E6600 processor is 65 W, and the power dissipation level of the AMD Athlon 64 X2 5000+ is 89 W. Directly comparing these values, of course, is not entirely correct, since companies use different methods to determine them, however, they are quite suitable for making some rough comparison.

Not much time has passed since the release of the previous material about new Intel processors, so it would be more logical to perceive this article not as an independent one, but as a kind of addition. It just so happened that the Intel Core 2 Duo E6600 processor fell into our hands after the publication of the first article. Of course, in itself it is not very interesting because... differs from the Core 2 Duo E6700 only in the multiplication factor reduced by one (and, accordingly, at 266 MHz lower frequency). Of course, it would be much more interesting to test the E6300/6400 with a “halved” cache, or even the youngest in the E4200 line, which also had the bus reduced to 800 MHz. Unfortunately, these CPUs have not yet reached us. Therefore, in the absence of the most desirable things, we suggest that you read yet another material on the topic “performance of the new Intel architecture in widespread real-world tasks.” Fortunately, the topic couldn’t get too boring - this is only the second material devoted to it :). Hardware and software

Test bench configuration

CPUMainboardMemory
Athlon 64 FX-62(BIOS 9.03)Corsair CM2X1024-6400 (5-5-5-12)
Athlon 64 FX-60EPoX EP-9NPA3 (BIOS 03/06/30)Corsair CMX1024-3500LLPRO (2-3-2-6)

Product release date.

Lithography

Lithography indicates the semiconductor technology used to produce integrated chipsets and the report is shown in nanometer (nm), which indicates the size of the features built into the semiconductor.

Number of Cores

Number of cores is a term hardware, describing the number of independent central processing units in a single computing component (chip).

Number of threads

A thread or thread of execution is a software term that refers to a basic, ordered sequence of instructions that can be transmitted or processed by a single CPU core.

Base processor clock speed

The base frequency of the processor is the speed at which the processor transistors open/close. The base frequency of the processor is the operating point where the design power (TDP) is set. Frequency is measured in gigahertz (GHz), or billions of cycles per second.

Cache memory

The processor cache is an area of ​​high-speed memory located in the processor. Intel® Smart Cache refers to an architecture that allows all cores to dynamically share last-level cache access.

System bus frequency

A bus is a subsystem that transfers data between computer components or between computers. An example is the system bus (FSB), through which data is exchanged between the processor and the memory controller unit; DMI interface, which is a point-to-point connection between the Intel Embedded Memory Controller and the Intel I/O Controller Assembly on system board; and a Quick Path Interconnect (QPI) connecting the processor and integrated memory controller.

System bus parity

System bus parity provides the ability to check for errors in data sent to the FSB (system bus).

Design power

Thermal design power (TDP) indicates the average performance in watts when the processor's power is dissipated (running at base frequency with all cores engaged) under a challenging workload as defined by Intel. Read the requirements for thermoregulation systems presented in the technical description.

Scenario Design Power (SDP)

Max. calc. Power is an additional thermoregulation reference point designed to accommodate high temperature applications while simulating real-world operating conditions. It balances performance and power requirements across workloads across the system, and delivers the world's most powerful systems utilization. Talk to technical description products for complete information on capacity specifications.

VID voltage range

The VID voltage range is an indicator of the minimum and maximum voltage values ​​at which the processor should operate. The processor communicates the VID with the VRM (Voltage Regulator Module), which in turn ensures the correct voltage level for the processor.

Available options for embedded systems

Available options for embedded systems indicate products that provide extended purchasing availability for intelligent systems and embedded solutions. Product specifications and conditions of use are provided in the Production Release Qualification (PRQ) report. Contact your Intel representative for details.

Supported Connectors

A connector is a component that provides mechanical and electrical connections between the processor and motherboard.

T CASE

The critical temperature is the maximum temperature allowed within the processor's integrated heat spreader (IHS).

Intel® Turbo Boost Technology‡

Intel® Turbo Boost Technology dynamically increases the processor frequency to the required level, using the difference between the nominal and maximum temperature and power parameters, allowing you to increase power efficiency or overclock the processor when necessary.

Intel® Hyper-Threading Technology‡

Intel® Hyper-Threading Technology (Intel® HT Technology) provides two processing threads for each physical core. Multithreaded applications can perform more tasks in parallel, making work much faster.

Intel® Virtualization Technology (VT-x)‡

Intel® Virtualization Technology for Directed I/O (VT-x) allows a single hardware platform to function as multiple “virtual” platforms. The technology improves management capabilities, reducing downtime and maintaining productivity by dedicating separate partitions for computing operations.

Intel® 64‡ Architecture

Intel® 64 architecture coupled with matching software Supports 64-bit applications on servers, workstations, desktops, and laptops.¹ Intel® 64 architecture delivers performance improvements that enable computing systems to utilize more than 4 GB of virtual and physical memory.

Command set

The command set contains basic commands and instructions that the microprocessor understands and can execute. The value shown indicates which Intel instruction set the processor is compatible with.

Idle states

Idle state (or C-state) mode is used to save power when the processor is idle. C0 means operating state, that is, the CPU is in this moment does useful work. C1 is the first idle state, C2 is the second idle state, etc. The higher the numerical indicator of the C-state, the more energy saving actions the program performs.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® technology delivers performance and compliance mobile systems to energy saving. Standard Intel SpeedStep® technology allows you to switch voltage and frequency levels depending on the load on the processor. Enhanced Intel SpeedStep® technology is built on the same architecture and uses design strategies such as voltage and frequency change separation, and clock distribution and recovery.

Intel® Demand Based Switching Technology

Intel® Demand Based Switching is a power management technology that keeps the microprocessor's application voltage and clock speed at the minimum required until increased processing power is required. This technology was introduced to the server market under the name Intel SpeedStep®.

Thermal control technologies

Thermal management technologies protect the processor chassis and system from failure due to overheating with multiple thermal management features. An on-chip Digital Thermal Sensor (DTS) senses core temperature, and thermal management features reduce processor chassis power consumption when necessary, thereby reducing temperatures to ensure operation within normal operating specifications.

New Intel® AES Commands

Intel® AES-NI (Intel® AES New Instructions) commands are a set of commands that enable you to quickly and securely encrypt and decrypt data. AES-NI commands can be used to solve a wide range of cryptographic problems, for example, in applications that provide group encryption, decryption, authentication, generation random numbers and authenticated encryption.

The execution cancel bit is a hardware security feature that can reduce vulnerability to viruses and malicious code, and prevent malware from executing and spreading on a server or network.

Core2 6600 processor, the price of a new one on Amazon and ebay is 6,500 rubles, which is equal to $112.

The number of cores is 2, produced using a 65 nm process technology, Conroe architecture.

The base frequency of the Core2 6600 cores is 2.4 GHz. The maximum frequency in Intel Turbo Boost mode reaches 1.45 GHz. Please note that the Intel Core2 6600 cooler must cool processors with a TDP of at least 65 W at standard frequencies. During overclocking, the requirements increase.

The motherboard for Intel Core2 6600 must have a PLGA775 socket. The power system must be able to withstand processors with a thermal package of at least 65 W.

Price in Russia

Do you want to buy a Core2 6600 cheap? Look at the list of stores that already sell the processor in your city.

Family

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Intel Core2 6600 test

The data comes from user tests who tested their systems both overclocked and unoverclocked. Thus, you see the average values ​​​​corresponding to the processor.

Numerical speed

Different tasks require different strengths CPU. A system with a small number of fast cores will be great for gaming, but will be inferior to a system with a large number of slow cores in a rendering scenario.

We believe that for the budget gaming computer A processor with at least 4 cores/4 threads is suitable. At the same time, some games can load it at 100% and slow down, and performing any tasks in the background will lead to a drop in FPS.

Ideally, the buyer should aim for a minimum of 6/6 or 6/12, but keep in mind that systems with more than 16 threads are currently only suitable for professional applications.

The data is obtained from tests of users who tested their systems both overclocked (the maximum value in the table) and without (the minimum). A typical result is shown in the middle, with the color bar indicating its position among all systems tested.

Accessories

We have compiled a list of components that users most often choose when assembling a computer based on Core2 6600. Also, with these components the best test results and stable operation are achieved.

Most popular config: motherboard for Intel Core2 6600 - Asus M4A785TD-M EVO, video card - GeForce 6600 GT.

Characteristics

Basic

Manufacturer Intel
Description Information about the processor taken from the official website of the manufacturer. Intel® Core™2 Duo Processor E6600 (4M Cache, 2.40 GHz, 1066 MHz FSB)
Architecture Code name for the microarchitecture generation. Conroe
Date of issue Month and year the processor went on sale. 03-2015
Model Official name. E6600
Cores Number of physical cores. 2
Streams Number of threads. The number of logical processor cores that the operating system sees. 2
Base frequency Guaranteed frequency of all processor cores at maximum load. Performance in single-threaded and multi-threaded applications and games depends on it. It is important to remember that speed and frequency are not directly related. For example, new processor at a lower frequency can be faster than the old one at a higher frequency. 2.4 GHz
Turbo frequency Maximum frequency of one processor core in turbo mode. Manufacturers have given the processor the ability to independently increase the frequency of one or more cores under heavy load, thereby increasing operating speed. It greatly affects the speed in games and applications that require CPU frequency. 1.45 GHz
L3 cache size The third level cache acts as a buffer between RAM computer and processor level 2 cache. Used by all cores, the speed of information processing depends on the volume. 4 MB
Instructions Allows you to speed up calculations, processing and execution of certain operations. Also, some games require support for instructions. 64-bit
Technical process The technological production process is measured in nanometers. The smaller the technical process, the more advanced the technology, the lower the heat generation and energy consumption. 65 nm
Bus frequency Speed ​​of data exchange with the system. 1066 MHz FSB
Maximum TDP Thermal Design Power is an indicator that determines the maximum heat dissipation. The cooler or water cooling system must be rated for an equal or greater value. Remember that TDP increases significantly with overclocking. 65 W

The date the product was first introduced.

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

#ofCores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor"s transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is typically measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of ​​fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

FSB Parity

FSB parity provides error checking on data sent on the FSB (Front Side Bus).

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Scenario Design Power (SDP)

Scenario Design Power (SDP) is an additional thermal reference point meant to represent thermally relevant device usage in real-world environmental scenarios. It balances performance and power requirements across system workloads to represent real-world power usage. Reference product technical documentation for full power specifications.

VID Voltage Range

VID Voltage Range is an indicator of the minimum and maximum voltage values ​​at which the processor is designed to operate. The processor communicates VID to the VRM (Voltage Regulator Module), which in turn delivers that correct voltage to the processor.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

T CASE

Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).

Intel® Turbo Boost Technology‡

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® Hyper-Threading Technology‡

Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.

Intel® Virtualization Technology (VT-x)‡

Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.

Intel® 64‡

Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Intel® Demand Based Switching

Intel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.

Intel® Trusted Execution Technology‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.




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